Job description
Location: TATA Semiconductor Assembly and Test, Jagiroad, India
Position Overview:
As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes.
You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both high-volume production and new product introductions (NPI).
This role demands a strong technical foundation, hands-on experience with packaging equipment, and the ability to collaborate across cross-functional teams including R&D, quality, and customer engineering.
Key Responsibilities:
1.
Process Development & Optimization
- Design and implement robust packaging processes including:
- Wire bonding (ball/wedge bonding, fine pitch, multi-row)
- Flip chip (underfill, reflow, thermal compression bonding)
- Integrated system packaging
- Conduct DOE (Design of Experiments) to optimize process parameters for yield, reliability, and throughput.
- Develop and maintain process documentation: SOPs, control plans, FMEAs, build sheets etc.
2.
Manufacturing Support
- Provide real-time support to production lines to resolve process-related issues.
- Monitor process KPIs such as yield, cycle time, defect rates, and equipment uptime.
- Lead root cause analysis and implement corrective actions for maverick lots and customer returns.
3.
New Product Introduction (NPI)
- Collaborate with customer engineering and R&D teams to transfer new products from prototype to mass production.
- Define tooling and equipment requirements for new packages.
- Execute qualification plans including reliability testing.
4.
Equipment & Tooling Management
- Work with equipment vendors to install, calibrate, and maintain packaging tools (e.g., wire bonders, flip chip bonder, molding machines, etc.).
- Drive automation and process standardization across multiple product lines.
5.
Quality & Compliance
- Ensure compliance with customer-specific requirements, JEDEC standards, and internal quality systems.
- Support internal and external audits (ISO, customer audits, etc..).
- Implement SPC and GR&R to monitor and control process stability.
Qualifications:
- Bachelor’s or Master’s degree in Electronics, Mechanical, Materials Science, or related field.
- 5–10 years of experience in semiconductor packaging, preferably in an OSAT environment.
- Hands-on experience with wire bonding, flip chip, and SiP technologies.
- Proficiency in statistical tools (Minitab, JMP), SPC, and Six Sigma methodologies.
- Strong analytical and problem-solving skills.
- Excellent communication skills; ability to work in a multicultural, fast-paced environment.
Preferred Skills:
- Experience with QFN, BGA, WLCSP, and other packages.
- Familiarity with substrate design, thermal modeling, and mechanical stress analysis.
- Knowledge of cleanroom protocols, ESD handling.
Required Skill Profession
Engineers